Description

Computer servers are becoming smaller while semiconductor chips use increasing amounts of power. New datacom equipment exceeds 20 kW per server rack, with the result that datacom centers face average power densities in excess of 150 W/ft² (1500 W/m²) based on the area of the room housing the equipment. Because traditional air cooling of datacom centers is reaching its practical limit, liquid cooling is being explored to keep up with these performance gains.

Citation: ASHRAE Journal, Vol. 46, No. 12, December 2004

Product Details

Published:

2004

Number of Pages:

5

File Size:

1 file , 1.1 MB

Product Code(s):

D-23126